HWlEiC Laser Showcases Advanced SiC Laser Processing Solutions at Third-Generation Semiconductor Technology Seminar

Third-Generation Semiconductor SiC Crystal Growth and Wafer Processing Technology Seminar

On May 28, 2026, the Third-Generation Semiconductor SiC Crystal Growth and Wafer Processing Technology Seminar, hosted by China Powder Network, was successfully held at the Sheraton Hefei Xinzhan Ligang Hotel.

A total of 220 experts, researchers, technical professionals, and industry representatives from across the silicon carbide (SiC) value chain attended the event. The seminar focused on in-depth discussions covering SiC single crystal growth technologies, advancements in wafer processing techniques, equipment applications, and future development trends of the SiC industry.

1. Analysis of Industry Development and Competitive Landscape

Mr. Yao Shuang, Deputy General Manager of HWlEiC Laser, delivered a keynote presentation titled:

“Application of Laser Precision Processing in SiC Materials”

The presentation provided a comprehensive analysis of the current development status and competitive landscape of the SiC industry, while systematically elaborating on the strategic significance of laser processing technologies in advancing SiC manufacturing.

Non-contact Laser Lift-Off (LLO) technology effectively eliminates tool wear and avoids mechanical stress-induced wafer damage, which are common issues in conventional processing methods. This enables high-quality and high-precision wafer separation, significantly improving both processing efficiency and yield of SiC wafers.

At the same time, LLO technology contributes to reducing the manufacturing cost of SiC substrates by minimizing material loss. It demonstrates clear advantages, including:

• High processing efficiency
• Low material loss
• Stable processing quality

Next-Generation Fully Automatic SiC Laser Lift-Off Equipment

Next-Generation Fully Automatic Semiconductor Laser Annealing Equipment

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New Generation Fully Automatic Laser Processing Equipment

During the seminar, HWlEiC Laser officially launched:

• New-generation fully automatic Laser Lift-Off (LLO) equipment
• Fully automatic laser annealing systems

Compared with the previous generation, the new systems have achieved significant improvements in technical performance, reflecting substantial advancements in process capability and system integration.

More importantly, this release demonstrates that HWlEiC Laser has developed the capability to deliver automated SiC production line solutions, moving beyond standalone equipment toward integrated manufacturing systems.

Technical Exchange and Industry Engagement

At the exhibition area, experts and industry professionals from various segments of the SiC ecosystem—including substrate manufacturing, epitaxy, device fabrication, and packaging—engaged in active discussions.

The exchanges focused on:

• Technical advantages of next-generation SiC wafer Laser Lift-Off equipment
• Laser annealing process optimization
• Production line integration and compatibility solutions

The on-site discussions were highly interactive, reflecting strong industry interest in advanced laser processing technologies for SiC applications.

Strategic Advancement Toward the Pan-Semiconductor Field

The launch of the new-generation fully automatic Laser Lift-Off and laser annealing systems marks a significant milestone in HWlEiC Laser’s strategic expansion into the pan-semiconductor sector.

Looking ahead, the company will continue to:

• Increase investment in research and development
• Strengthen industry–university–research collaboration
• Enhance core technological capabilities
• Improve overall product competitiveness

HWlEiC Laser remains committed to delivering advanced laser processing solutions that support the continuous evolution of semiconductor manufacturing.