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<\/p>\nOn May 28, 2026, the Third-Generation Semiconductor SiC Crystal Growth and Wafer Processing Technology Seminar, hosted by China Powder Network, was successfully held at the Sheraton Hefei Xinzhan Ligang Hotel.<\/p>\n
A total of 220 experts, researchers, technical professionals, and industry representatives from across the silicon carbide (SiC) value chain attended the event. The seminar focused on in-depth discussions covering SiC single crystal growth technologies, advancements in wafer processing techniques, equipment applications, and future development trends of the SiC industry.<\/p>\n
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Mr. Yao Shuang, Deputy General Manager of HWlEiC Laser, delivered a keynote presentation titled:<\/p>\n
\u201cApplication of Laser Precision Processing in SiC Materials\u201d<\/strong><\/p>\n The presentation provided a comprehensive analysis of the current development status and competitive landscape of the SiC industry, while systematically elaborating on the strategic significance of laser processing technologies in advancing SiC manufacturing.<\/p>\n Non-contact Laser Lift-Off (LLO) technology<\/strong> effectively eliminates tool wear and avoids mechanical stress-induced wafer damage, which are common issues in conventional processing methods. This enables high-quality and high-precision wafer separation, significantly improving both processing efficiency and yield of SiC wafers.<\/p>\n At the same time, LLO technology contributes to reducing the manufacturing cost of SiC substrates by minimizing material loss. It demonstrates clear advantages, including:<\/p>\n <\/p>\n Next-Generation Fully Automatic SiC Laser Lift-Off Equipment<\/p>\n Next-Generation Fully Automatic Semiconductor Laser Annealing Equipment<\/p>\n —————————————————————————————————————————–<\/p>\n During the seminar, HWlEiC Laser officially launched:<\/p>\n Compared with the previous generation, the new systems have achieved significant improvements in technical performance, reflecting substantial advancements in process capability and system integration.<\/p>\n More importantly, this release demonstrates that HWlEiC Laser has developed the capability to deliver automated SiC production line solutions<\/strong>, moving beyond standalone equipment toward integrated manufacturing systems.<\/p>\n At the exhibition area, experts and industry professionals from various segments of the SiC ecosystem\u2014including substrate manufacturing, epitaxy, device fabrication, and packaging\u2014engaged in active discussions.<\/p>\n The exchanges focused on:<\/p>\n The on-site discussions were highly interactive, reflecting strong industry interest in advanced laser processing technologies for SiC applications.<\/p>\n The launch of the new-generation fully automatic Laser Lift-Off and laser annealing systems marks a significant milestone in HWlEiC Laser\u2019s strategic expansion into the pan-semiconductor sector.<\/p>\n Looking ahead, the company will continue to:<\/p>\n HWlEiC Laser remains committed to delivering advanced laser processing solutions that support the continuous evolution of semiconductor manufacturing.<\/p>","protected":false},"excerpt":{"rendered":" On May 28, 2026, the Third-Generation Semiconductor SiC Crystal Growth and Wafer Processing Technology Seminar, hosted by China Powder Network, was successfully held at the Sheraton Hefei Xinzhan Ligang Hotel.<\/p>","protected":false},"featured_media":5838,"comment_status":"closed","ping_status":"closed","template":"","class_list":["post-5846","news","type-news","status-publish","has-post-thumbnail","hentry"],"acf":[],"_links":{"self":[{"href":"https:\/\/hwleiclaser.com\/ru\/wp-json\/wp\/v2\/news\/5846","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/hwleiclaser.com\/ru\/wp-json\/wp\/v2\/news"}],"about":[{"href":"https:\/\/hwleiclaser.com\/ru\/wp-json\/wp\/v2\/types\/news"}],"replies":[{"embeddable":true,"href":"https:\/\/hwleiclaser.com\/ru\/wp-json\/wp\/v2\/comments?post=5846"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/hwleiclaser.com\/ru\/wp-json\/wp\/v2\/media\/5838"}],"wp:attachment":[{"href":"https:\/\/hwleiclaser.com\/ru\/wp-json\/wp\/v2\/media?parent=5846"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}\n
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<\/p>\nNew Generation Fully Automatic Laser Processing Equipment<\/h2>\n
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<\/p>\nTechnical Exchange and Industry Engagement<\/h2>\n
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<\/p>\nStrategic Advancement Toward the Pan-Semiconductor Field<\/h2>\n
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